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DISCRETE SEMICONDUCTORS
DATA SHEET
handbook, halfpage
M3D283
KMI15/4 Rotational speed sensor
Product specification Supersedes data of 2000 Jun 26 2000 Sep 05
Philips Semiconductors
Product specification
Rotational speed sensor
FEATURES * Digital current output signal * Zero speed capability * Wide air gap * Wide temperature range * Vibration insensitive * EMC resistant. DESCRIPTION
handbook, halfpage
KMI15/4
PINNING PIN 1 2 VCC V- DESCRIPTION
The KMI15/4 sensor detects rotational speed of ferrous gear wheels and reference marks(1). The sensor consists of a magnetoresistive sensor element, a signal conditioning integrated circuit in bipolar technology and a ferrite magnet. The frequency of the digital current output signal is proportional to the rotational speed of a gear wheel. CAUTION Do not press two or more products together against their magnetic forces.
(1) The sensor contains a customized integrated circuit. Usage in hydraulic brake systems and in systems with active brake control is forbidden. For all other applications, higher temperature versions of up to 150 C are available on request.
1 2
MBH782
Fig.1 Simplified outline (SOT453C).
QUICK REFERENCE DATA SYMBOL VCC Tamb ICC (low) ICC (high) ft d PARAMETER DC supply voltage ambient operating temperature current output signal low current output signal high operating tooth frequency sensing distance - -40 - - 0 0 to 2.0 MIN. 12 - 7 14 - 0 to 2.3 TYP. - +85 - - 25000 - MAX. V C mA mA Hz mm UNIT
2000 Sep 05
2
Philips Semiconductors
Product specification
Rotational speed sensor
LIMITING VALUES In accordance with Absolute Maximum Rating System (IEC 60134). SYMBOL VCC Tstg Tamb Tsld PARAMETER DC supply voltage storage temperature operating ambient temperature soldering temperature output short-circuit duration to GND t 10 s CONDITIONS Tamb = -40 to +85 C; RL = 115 MIN. -0.5 -40 -40 -
KMI15/4
MAX. +16 +150 +85 260 V
UNIT C C C
continuous
CHARACTERISTICS Tamb = 25 C; VCC = 12 V; d = 1.5 mm; ft = 2 kHz; test circuit: see Fig.7; RL = 115 ; sensor positioning: see Fig.15; gear wheel: module 2 mm; material 1.0715; unless otherwise specified. SYMBOL ICC (low) ICC (high) tr tf td ft d Note 1. High rotational speeds of wheels reduce the sensing distance due to eddy current effects (see Fig.17). PARAMETER current output signal low current output signal high output signal rise time output signal fall time switching delay time CONDITIONS see Figs 6 and 8 see Figs 6 and 8 CL = 100 pF; see Fig.9; 10 to 90% value CL = 100 pF; see Fig.9; 10 to 90% value MIN. 5.6 11.2 - - 7 14 0.5 0.7 1 - 50 TYP. MAX. 8.4 16.8 - - - 25000 80 UNIT mA mA s s s Hz mm %
between stimulation pulse (generated by - a coil) and output signal 0 20 see Fig.15 and note 1 see Fig.6
operating tooth frequency for both rotation directions sensing distance duty cycle
0 to 2.0 0 to 2.3 -
2000 Sep 05
3
Philips Semiconductors
Product specification
Rotational speed sensor
FUNCTIONAL DESCRIPTION The KMI15/4 sensor is sensitive to the motion of ferrous gear wheels or reference marks. The functional principle is shown in Fig.3. Due to the effect of flux bending, the different directions of magnetic field lines in the magnetoresistive sensor element will cause an electrical signal. Because of the chosen sensor orientation and the direction of ferrite magnetization, the KMI15/4 is sensitive to movement in the `y' direction in front of the sensor only (see Fig.2). The magnetoresistive sensor element signal is amplified, temperature compensated and passed to a Schmitt-trigger in the conditioning integrated circuit (Figs 4 and 5). The digital output signal level (see Fig.6) is at a fixed level independent of the sensing distance. A (2-wire) output current enables safe sensor signal transport to the detecting circuit (see Fig.7). The integrated circuit housing is separated from the sensor element housing to optimize the sensor behaviour at high temperatures. The strength of the magnetic field caused by the Ferroxdure 100 magnet in the different sensor directions, measured at the centre of the magnetoresistive bridge, is typically: Hx = 7 kA/m (auxiliary field) and Hz = 17 kA/m (perpendicular to the sensor surface). Hy is zero due to the trimming process.
handbook, halfpage
KMI15/4
x magnet with direction of magnetization
x z
y
sensor
IC
MBH779
Fig.2 Component detail of the KMI15/4.
gear handbook, full pagewidth wheel z magnet magnetic field lines direction of motion
sensor
y
MRA957
(a)
(b)
(c)
(d)
Fig.3 Functional principle.
2000 Sep 05
4
Philips Semiconductors
Product specification
Rotational speed sensor
KMI15/4
handbook, full pagewidth
VOLTAGE CONTROL
CONSTANT CURRENT SOURCE
V CC
SENSOR
AMPLIFIER
SCHMITT TRIGGER
SWITCHABLE CURRENT SOURCE
V
MRA958
Fig.4 Block diagram.
handbook, full pagewidth
VCC switchable current source constant current source
sensor
power supply
EMC FILTER preamplifier Schmitttrigger
Vref GAP
V
MRA959
Fig.5 Simplified circuit diagram.
2000 Sep 05
5
Philips Semiconductors
Product specification
Rotational speed sensor
KMI15/4
handbook, halfpage
MRA960
I CC T 14 mA V CC SENSOR 7 mA tp I CC RL t CL GND
MRA961
V
tp = --- x 100% T
Fig.6 Output signal as a function of time.
Fig.7 Test and application circuit.
APPLICATION INFORMATION
handbook, halfpage I
16
MRA967
CC (mA) 14
handbook, halfpage
1
MRA968
VCC = 20 V
VCC = 12 V VCC = 8 V
t ( s)
0.8 I CC(high)
tf
12 0.6 10 0.4 8 VCC = 20 V I CC(low) VCC = 12 V 0.2 VCC = 8 V 0 tr 50 0 50 100 tf t 4 50 0 50 100 150 200 Tamb (oC) 150 200 Tamb ( oC) ICC tr
6
Fig.8
Output current levels as functions of ambient temperature; typical values.
Fig.9
Output current switching times as functions of ambient temperature; typical values.
2000 Sep 05
6
Philips Semiconductors
Product specification
Rotational speed sensor
Mounting conditions The recommended sensor position in front of a gear wheel is shown in Fig.15. Distance `d' is measured between the sensor front and the tip of a gear wheel tooth. The KMI15/4 senses ferrous indicators like gear wheels in the y direction only (no rotational symmetry of the sensor); see Fig.2. The effect of incorrect mounting positions on sensing distance is shown in Figs 11, 12 and 13. The symmetrical reference axis of the sensor corresponds to the axis of the ferrite magnet. Environmental conditions Due to eddy current effects the sensing distance depends on the tooth frequency (see Fig.17). The influence of gear wheel module on the sensing distance is shown in Fig.16. Gear Wheel Dimensions SYMBOL German DIN z d m p ASA; note1 PD DP CP Note number of teeth diameter module m = d/z pitch p = x m DESCRIPTION
KMI15/4
UNIT
mm mm mm
pitch diameter (d in inch) diametric pitch DP = z/PD circular pitch CP = /DP
inch inch-1 inch
1. For conversion from ASA to DIN: m = 25.4 mm/DP; p = 25.4 mm x CP.
handbook, halfpage
4
MBD840
d (mm) pitch
handbook, halfpage
y d ft
3
2
pitch diameter
MRA964
1
0 0
1
2
3
y (mm)
4
pitch diameter module = ----------------------------------------number of teeth pitch = module x
VCC = 12 V; ft = 2 kHz; module = 2 mm; pitch diameter = 100 mm.
Fig.10 Gear wheel dimensions.
Fig.11 Sensing distance as a function of positional tolerance in the y-axis; typical values.
2000 Sep 05
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Philips Semiconductors
Product specification
Rotational speed sensor
KMI15/4
handbook, halfpage
4
MBD841
d
handbook, halfpage
3
MBD842
d (mm) 3
ft
d (mm) 2 - + x
2
d 1
1
10 mm
0 0
0
1
2
3
(deg)
4
-6
-4
-2
0
2
4
6 x (mm)
VCC = 12 V; ft = 2 kHz; module = 2 mm.
VCC = 12 V; ft = 2 kHz; module = 2 mm.
Fig.12 Sensing distance as a function of positional tolerance; typical values.
Fig.13 Sensing distance as a function of positional tolerance in the x-axis; typical values.
handbook, halfpage
4
MBD839
d (mm)
3
handbook, halfpage
sensor d
d
2 d 1 gear wheel
MRA963
0 -50
0
50
100
150
200 Tamb ( o C)
Fig.14 Typical sensing distance as a function of ambient temperature; typical values.
Fig.15 Sensor positioning.
2000 Sep 05
8
Philips Semiconductors
Product specification
Rotational speed sensor
KMI15/4
handbook, halfpage
1.5
MRA966
handbook, halfpage
4
MBD843
d d0
d (mm) 3
1
2 d
0.5
1
ft
0
0
1
2
3
4 5 module m (mm)
0 0
1
2
3
f t (kHz)
4
d0 = sensing distance for gear wheel with module = 2 mm. VCC = 12 V; module = 2 mm.
Fig.16 Normalized maximum sensing distance as a function of a gear wheel module; typical values.
Fig.17 Sensing distance as a function of tooth frequency; typical values.
2000 Sep 05
9
Philips Semiconductors
Product specification
Rotational speed sensor
EMC Figure 18 shows a recommended application circuit for automotive applications (wheel sensing ft < 5 kHz). It provides a protection interface to meet Electromagnetic Compatibility (EMC) standards and safeguard against voltage spikes Table 1 lists the tests which are applicable to this circuit and the achieved class of functional status. Protection against `load dump' (test pulse 5 according to "DIN 40839") means a very high demand on the protection circuit and requires a suitable suppressor diode with sufficient energy absorption capability. Table 1 EMC test results SYMBOL VLD VLD VLD VLD VLD VLD - -150 - -7 - MIN. (V) -100 - 100 - 100 - 120 MAX. (V) REMARKS td = 2 ms td = 0.2 ms td = 0.1 s td = 0.1 s td = 130 ms td = 400 ms C A A A B B
KMI15/4
The board net often contains a central load dump protection that makes such a device in the protection circuit of the sensor module unnecessary. Tests for electrostatic discharge (ESD) were conducted in line with "IEC 801-2" to demonstrate the KMI15/4's handling capabilities. The "IEC 801-2" test conditions were: C = 150 pF, R = 150 , V = 2 kV. Electromagnetic disturbances with fields up to 150 V/m and f = 1 GHz (ref. "DIN 40839") have no influence on performance.
EMC REF. DIN 40839 Test pulse 1 Test pulse 2 Test pulse 3a Test pulse 3b Test pulse 4 Test pulse 5
CLASS
handbook, halfpage
D1
+V
VCC 1N4001/3 BZTO3G36 D2 C1 100 nF RL 115 CL 100 nF -V
SENSOR
GND
MGD805
Fig.18 Test/application circuit for the KMI15/4.
2000 Sep 05
10
Philips Semiconductors
Product specification
Rotational speed sensor
PACKAGE OUTLINE Plastic single-ended multi-chip package; magnetized ferrite magnet (5.5 x 5.5 x 3 mm); 4 interconnections; 2 in-line leads
KMI15/4
SOT453C
M1 HE1 E B
vMAB K A Q
A L1 M2 bp1 D2 L L3 vMAB M3 D
E1
SENSOR DIE POSITION centre of reading point D1
HE
*
L2 1 bp e 0 2.5 scale DIMENSIONS (mm are the original dimensions) UNIT A(1) mm Notes 1. Glue thickness not included. 2. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT453C REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 99-09-23 00-08-31 1.7 1.4 bp 0.8 0.7 bp1 1.57 1.47 c 0.3 0.24 D(2) D1(2) D2(2) E(2) E1(2) 4.1 3.9 5.7 5.5 3.15 2.95 4.5 4.3 5.7 5.5 e 4.6 4.4 HE 18.2 17.8 HE1 5.6 5.5 K max. 3.87 L 7.55 7.25 L1 1.2 0.9 L2 3.9 3.5 L3 6.55 6.35 M1 M2 M3(1) Q v 5 mm 2 c
5.65 5.65 3.15 0.75 0.25 5.35 5.35 2.85 0.65
2000 Sep 05
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Philips Semiconductors
Product specification
Rotational speed sensor
DATA SHEET STATUS DATA SHEET STATUS Objective specification PRODUCT STATUS Development DEFINITIONS (1)
KMI15/4
This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
Preliminary specification
Qualification
Product specification
Production
Note 1. Please consult the most recently issued data sheet before initiating or completing a design. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
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Philips Semiconductors
Product specification
Rotational speed sensor
NOTES
KMI15/4
2000 Sep 05
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Philips Semiconductors
Product specification
Rotational speed sensor
NOTES
KMI15/4
2000 Sep 05
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Philips Semiconductors
Product specification
Rotational speed sensor
NOTES
KMI15/4
2000 Sep 05
15
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For all other countries apply to: Philips Semiconductors, Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 2000
Internet: http://www.semiconductors.philips.com
SCA 70
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613520/04/pp16
Date of release: 2000
Sep 05
Document order number:
9397 750 07471

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